• Part: MR16R1624AF0
  • Description: (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
  • Manufacturer: Samsung Semiconductor
  • Size: 419.61 KB
Download MR16R1624AF0 Datasheet PDF
MR16R1624AF0 datasheet preview
MR16R1624AF0 page 2
Page 2
MR16R1624AF0 page 3
Page 3

Datasheet Summary

MR16R1622(4/8/G)AF0 MR18R1622(4/8/G)AF0(1) Change History Version 1.1 (August 2001) - First copy. - Based on the 1.0ver Rambus 256/288Mbit RIMM Module Datasheet Version 1.2 (February 2002) - Add 1066-35 binning Version 1.3 (April 2002) - Add 800-40 and 1066-32 binning - Modify ∆TPD Value of AC electrical specifications - Modify the Values of AC electrical specifications for RIMM Module Version 1.4 (July 2002) - Add 1066-32 512MB (16d RIMM Module) etc. Page 0 Version 1.4 July 2002 MR16R1622(4/8/G)AF0 MR18R1622(4/8/G)AF0(1) (16Mx16)- 2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V (16Mx18)- 2(4/8/16)pcs RIMM Module based on 288Mb A-die, 32s banks,16K/32ms...

Related Samsung Semiconductor Datasheets

Part Number Description
MR16R1624DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1624DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1624GEG0 Key Timing Parameters
MR16R1622AF0 (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
MR16R1622DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters