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MR16R1624AF0 Datasheet (mr1xr1622(4/8/g)af0) (16mx16)x2(4/8/16)pcs Rimm Module Based On 256mb A-die

Manufacturer: Samsung Semiconductor

Overview: MR16R1622(4/8/G)AF0 MR18R1622(4/8/G)AF0(1) Change History Version 1.1 (August 2001) * First copy. * Based on the 1.0ver Rambus 256/288Mbit RIMM Module Datasheet Version 1.

This datasheet includes multiple variants, all published together in a single manufacturer document.

Key Features

  • 256M x 16/18 -CN9 -CM8 -CK8.
  • High speed up to 1066 MHz RDRAM storage.
  • 184 edge connector pads with 1mm pad spacing.
  • Module PCB size : 133.35mm x 31.75mm x 1.27mm (5.25” x 1.25” x 0.05”) - 256Mb base RIMM Module.
  • Module PCB size : 133.35mm x 34.93mm x 1.27mm Form Factor The RIMM modules are offered in 184-pad 1mm edge connector pad pitch suitable for 184 contact RIMM connectors. Figure 1 below, shows a sixteen device RIMM module. (5.25” x 1.375” x 0.05”) -.

More Datasheets from Samsung Semiconductor

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MR16R1624DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1624DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1624GEG0 Key Timing Parameters
MR16R1622AF0 (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
MR16R1622DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1628AF0 (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
MR16R1628DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1628DF0 (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1628GEG0 Key Timing Parameters
MR16R162GAF0 (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die

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